Sequential Algorithm of Parabolic Equation in Solving Thermal Control Process on Printed Circuit Board
Keywords:Sequential Algorithm, Parabolic Equation, Thermal Control Process, Printed Circuit Board,
AbstractThis paper focuses on the implementation of sequential algorithms for the simulation of parabolic equation in solving the thermal control systems. The platform of the temperature behaviour prediction is based on printed circuit board. The numerical finite-difference method (FDM) is used to design the discretization of these partial differential equations. The results of finite-difference approximation are presented graphically. Numerical methods that are used in solving the problem are the method of Jacobi, Gauss-Seidel, Red-Black Gauss-Seidel, Successive Over Relaxation (SOR) and Red-Black Successive Over Relaxation. The numerical analysis is treated done in terms of time execution, computation complexity, number of iterations, accuracy and convergence rate.
Ammous et. al., Choosing a Thermal Model for Electrothermal Simulation of Power Semiconductor Devices, IEEE Transactions On Power Electronics, pp 300-307, 1999
Gardell, D. L., Temperature Control During High-Power Wafer Test. Proc. of the International Intersociety Electronic Packaging Conference, InterPack '95 Lahaina, Hawaii, 1995
Heng Cheng Han, Fatimah Sham, Active Thermal Control System Design, Thesis of Bachelor Degree, UTM Skudai, 2007
Jerry I. Tustaniwskyj and James W. Babcock, High Performance Active Thermal Control of a Device under Test (DUT), 20th IEEE SEMI-THERM Symposium, 2004